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Copper-Molybdenum
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Concept Métal, your supplier of copper-molybdenum
Copper-molybdenum (Cu-Mo) is a composite material that combines the thermal conductivity of copper with the dimensional stability of molybdenum. This balance makes it a benchmark material for thermal management in power electronic components.
What is copper-molybdenum?
Copper-molybdenum is a composite material produced by infiltrating copper into a porous sintered molybdenum structure. The copper-to-molybdenum ratio varies depending on the desired properties; the most common compositions are Mo70Cu30 and Mo85Cu15.
This material offers key advantages for electronics:
- good thermal conductivity
- an adjustable thermal expansion coefficient
- compatibility with ceramic substrates (alumina, AlN)
- good machinability and suitability for plating
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The Properties of Copper-Molybdenum
Thermal Management
Copper provides high thermal conductivity, which allows for the efficient dissipation of heat generated by electronic components. Molybdenum, on the other hand, limits thermal expansion to prevent mechanical stress.
CTE Compatibility
By adjusting the Cu/Mo ratio, the coefficient of thermal expansion (CTE) can be matched to that of ceramic or semiconductor substrates, reducing the risk of cracking and delamination.
Plating Compatibility
Copper-molybdenum can be plated with nickel, gold, or silver to facilitate brazing and improve surface strength.
What are the applications of copper-molybdenum?
Copper-molybdenum is used for:
- Bases and substrates for power modules (IGBTs)
- Heat sinks for electronic components
- airtight semiconductor packaging
- chip carriers for the aerospace and defense industries
- components for high-frequency telecommunications
Applications
- Electrical Industry
- Electronics Industry
- Chemical Industry
- Defense Industry
Available Sizes
- Round bars
- Flat-bottomed
- Plates
- Son
- Strips
- Custom-made: forgings, blocks, and discs; parts made to specifications
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